Do you know what ENEPIG is in PCB?

 What is ENEPIG？ENEPIG-Electroless Nickel Electroless Palladium Immersion Gold is a surface finish for Printed Circuit Boards.ENEPIG works well with lead free and conventional eutectic solder alloys.This is the best way for gold wire bonding. Advantages for ENEPIG:

• “Black Nickel” free – no possibility of grain boundary corrosion of nickel surface by immersion gold
• Palladium acts as an additional barrier layer to further reduce copper diffusion to surface, thus ensuring good solderability
• Palladium completely dissolves into solder, without leaving an excessively high P% rich interface, exposing an oxide-free nickel surface allowing reliable formation of Ni/Sn intermetallic
• Withstands multiple lead-free reflow soldering cycles
• Demonstrates excellent gold wire bondability
• Process costs substantially lower than electrolytic nickel gold or electroless nickel electroless gold

​Many University customers need ENEPIG to do research. see an example from CMU.
​Chip on-board designed by carnegie mellon university,made by storm circuit.

Please visit our blog to see details of the ENEPIG documents.
http://www.stormcircuit.net

Spectrum confirms the presence of Nickel (Ni), Gold (Au), and Palladium (Pd)​.

Element maps

ENEPIG Proves

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Here is an ENEPIG PCB ,60GHz Transceiver DC Board for Columbia University.
Thickness:Ni:3-5um +/-5%,  Pd:0.1um +/-10%, Au:0.05um +/-10%

Top layer with ENEPIG finish.

TOP SIDE,ENEPIG PCB

ENEPIG board,Bottom layer with bare copper

Nano Research Lab,0.2mm FR4 PCB.ENEPIG surface finish.

Comparison of Surface Finish Performance

Characteristics	OSP	ENIG	Immersion Tin	Immersion Siver	ENEPIG
Shelf Life	< 12 Months/td>	> 12 Months	3-6 Months	< 12 Months	> 12 Months
Multiple Soldering Cycles	Fair to good	good	Fair to good	Fair to good	good
No Clean Flux Usage	PTH/via fill concerns	No concerns	No concerns	No concerns	No concerns
Solder Joint Reliability	Good	Good process control required to avoid "black pad	Good	Interfacial microvoid concerns	Good
Gold Wire bonding	NO	NO	NO	NO	YES
Corrosion Risk after Assembly	YES	NO	NO	NO	YES
Corrosion Risk after Assembly	YES	NO	YES	NO	NO
Contact Surface Applications	NO	YES	NO	NO	YES
Total Coating Thickness (um)	>0.15	Au:0.08-0.13,Ni:3.0-6.0	Tin:1.0-1.1	0.05-0.1	AU:0.03-0.05,Pd:0.05-0.1,Ni:3-5

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