HDI-HIGH DENSITY INTERCONNECT PCB
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0.5mm pitch BGA design guide--NO trace go through BGA pads
Gerber file for 6 layer HDI board.
Specification:FR4,TG170,1.2mm,1oz for all layers. min via:0.15mm, min trace/space:0.1/0.1mm. Impedance control,Black solder mask,ENIG Blind/burried vias (L1-L2,L1-L3,L4-L6,L5-L6) |
Examples of HDI stack up
Real Board for the left Gerber.
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Download
Multilayer standard stack up
PCB Fab check list
PCB capability
Sample BOM
Flex PCB material
High frequency material
Multilayer standard stack up
PCB Fab check list
PCB capability
Sample BOM
Flex PCB material
High frequency material