Quick Turn HDI pcb made by Storm Circuit

HDI-HIGH DENSITY INTERCONNECT PCB
Any layer/ELIC (Every layer interconnection)

HDI PCBs capitalize on the latest technologies available to increase the functionality of PCBs using the same or less amount of area. This advancement in PCB technology is driven by the miniaturization of components and semiconductor packages that supports advanced features in revolutionary new products such as touch screen computing and 4G network communications,now it is 5G time,any layer technology is required for PCB .

HDI PCBs are characterized by high-density attributes including laser microvias, fine lines and high performance thin materials. This increased density enables more functions per unit area. Higher technology HDI PCBs have multiple layers of copper filled stacked microvias (Advanced HDI PCBs) which creates a structure that enables even more complex interconnections. These very complex structures provide the necessary routing solutions for today's large pin-count chips utilized in mobile devices and other high technology products. Most HDI boards are with burried/blind vias from 0.076-0..127mm.

Vias for HDI is 3-5 mil (0.076-0.127mm),line width is from 3-4mil(0.076-0.1mm). 0.8mm /0.5mm pitch BGA is usually for 1+N+1. Another thing is many customers did not know HDI board have to use special material--RCC (Resion Coated Copper),0.08mm thickness with copper.

0.4mm pitch BGA, means the space from BGA ball to another BGA ball is 0.4mm.
Many PCB designers do not know much how to design 0.4mm pitch BGA board,they make things very difficult to do .Here is a 0.4mm pitch BGA PCB design guide from TI OMAP processor. Pages 8 through 12 talk about pads, mask and vias. Obviously, you should consult similar materials written specifically for the part you are using, but Ti did a great job of covering all the issues here.

0.38MM PITCH BGA PCB made by Storm Circuit

Below is an example we made for 0.38mm pitch CSP PCB.
This PCB is very small,10*10mm, and blind vias from L1-L2,it is 4 layer PCB ,0.6mm, half-hole plating.min hole 0.15mm,via in pad, 0.38mm pitch BGA. All the above features, we can see from below image.

0.38 CSP PCB

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Any layer/ELIC (every layer interconnection) is the most complex PCB to do.We made a few of such prototype PCBs.

10 Layer HDI board,0.5mm pitch BGA. 4/4mil,0.15mm vias,Tablet PC mother board

8 layer HDI board ,impedence control,3/3mil 0.1mm vias,Telecom board,burried/blind vias with 0.1mm

0.5mm pitch BGA design guide--NO trace go through BGA pads

Gerber file for 6 layer HDI board.
Specification:FR4,TG170,1.2mm,1oz for all layers.
min via:0.15mm, min trace/space:0.1/0.1mm.
Impedance control,Black solder mask,ENIG
Blind/burried vias (L1-L2,L1-L3,L4-L6,L5-L6）